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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
John Lau
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Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
John Lau
This book is an essential resource for researchers, engineers, and students in electrical engineering, mechanical engineering, materials science, and industrial engineering, equipping them with the knowledge to advance innovation in semiconductor packaging and integration.
| Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
| Lançado | 19 de maio de 2025 |
| ISBN13 | 9789819641659 |
| Editoras | Springer Nature Switzerland AG |
| Páginas | 645 |
| Dimensões | 1,28 kg |
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