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From Contamination to Defects, Faults and Yield Loss: Simulation and Applications - Frontiers in Electronic Testing Softcover reprint of the original 1st ed. 1996 edition
Jitendra B. Khare
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From Contamination to Defects, Faults and Yield Loss: Simulation and Applications - Frontiers in Electronic Testing Softcover reprint of the original 1st ed. 1996 edition
Jitendra B. Khare
Given such a high level of investment, it is critical for IC manufacturers to reduce manufacturing costs and get a better return on their investment. The most obvious method of reducing the manufacturing cost per die is to improve manufacturing yield.
150 pages, biography
| Mídia | Livros Paperback Book (Livro de capa flexível e brochura) |
| Lançado | 26 de setembro de 2011 |
| ISBN13 | 9781461285953 |
| Editoras | Springer-Verlag New York Inc. |
| Páginas | 150 |
| Dimensões | 155 × 235 × 9 mm · 249 g |
| Idioma | English |
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