Mostrando  Paperback Book   ·   Mostrar tudo
Mostrar itens não disponíveis

Lançamentos por Zhang, Hengyun (Shanghai University of Engineering Science, China)

15 de novembro de 2019

Cover for Zhang, Hengyun (Shanghai University of Engineering Science, China) · Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore - Woodhead Publishing Series in Electronic and Optical Materials (Paperback Book) (2019)
Paperback Book
Modeling, Analysis, Design, and ...
Zhang, Hengyun (Shanghai Univers...