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Electromigration Modeling at Circuit Layout Level - SpringerBriefs in Applied Sciences and Technology 2013 edition
Cher Ming Tan
Electromigration Modeling at Circuit Layout Level - SpringerBriefs in Applied Sciences and Technology 2013 edition
Cher Ming Tan
Integrated circuit (IC) reliability is of increasing concern in present-day IC technology where the interconnect failures significantly increases the failure rate for ICs with decreasing interconnect dimension and increasing number of interconnect levels.
120 pages, 73 black & white illustrations, 2 colour illustrations, biography
Mídia | Livros Paperback Book (Livro de capa flexível e brochura) |
Lançado | 4 de maio de 2013 |
ISBN13 | 9789814451208 |
Editoras | Springer Verlag, Singapore |
Páginas | 103 |
Dimensões | 155 × 235 × 6 mm · 1,88 kg |
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