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Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering 2020 edition
Cheng
Modeling and Application of Electromagnetic and Thermal Field in Electrical Engineering 2020 edition
Cheng
Co-authored by an international research group with a long-standing cooperation, this book focuses on engineering-oriented electromagnetic and thermal field modeling and application.
685 pages, 110 Tables, color; 232 Illustrations, color; 391 Illustrations, black and white; XXX, 685
Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
Lançado | 16 de dezembro de 2019 |
ISBN13 | 9789811501722 |
Editoras | Springer Verlag, Singapore |
Páginas | 685 |
Dimensões | 1,17 kg |
Editor | Cheng, Zhiguang |
Editor | Forghani, Behzad |
Editor | Takahashi, Norio |
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