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More-than-Moore 2.5D and 3D SiP Integration 1st ed. 2017 edition
Riko Radojcic
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More-than-Moore 2.5D and 3D SiP Integration 1st ed. 2017 edition
Riko Radojcic
This book presents a realistic and a holistic review of the microelectronic and semiconductor technology options in the post Moore's Law regime.
182 pages, 2 black & white illustrations, 66 colour illustrations, 58 colour tables, biography
| Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
| Lançado | 20 de fevereiro de 2017 |
| ISBN13 | 9783319525471 |
| Editoras | Springer International Publishing AG |
| Páginas | 182 |
| Dimensões | 155 × 235 × 13 mm · 458 g |
| Idioma | French |
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