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Die-stacking Architecture - Synthesis Lectures on Computer Architecture
Yuan Xie
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Die-stacking Architecture - Synthesis Lectures on Computer Architecture
Yuan Xie
The emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors.
| Mídia | Livros Paperback Book (Livro de capa flexível e brochura) |
| Lançado | 10 de junho de 2015 |
| ISBN13 | 9783031006197 |
| Editoras | Springer International Publishing AG |
| Páginas | 113 |
| Dimensões | 150 × 220 × 10 mm · 231 g |
| Idioma | English |
![Cover for Yuan Xie · Three-dimensional Integrated Circuit Design: Eda, Design and Microarchitectures - Integrated Circuits and Systems (Paperback Book) [Previously Published in Hardcover edition] (2012)](https://imusic.b-cdn.net/images/item/original/137/9781461425137.jpg?yuan-xie-2012-three-dimensional-integrated-circuit-design-eda-design-and-microarchitectures-integrated-circuits-and-systems-paperback-book&class=scaled&v=1608807059)
![Cover for Yuan Xie · Three-Dimensional Integrated Circuit Design: EDA, Design and Microarchitectures - Integrated Circuits and Systems (Hardcover Book) [2010 edition] (2009)](https://imusic.b-cdn.net/images/item/original/837/9781441907837.jpg?yuan-xie-2009-three-dimensional-integrated-circuit-design-eda-design-and-microarchitectures-integrated-circuits-and-systems-hardcover-book&class=scaled&v=1582820453)