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RF and Microwave Microelectronics Packaging Ken Kuang 2010 edition
RF and Microwave Microelectronics Packaging
Ken Kuang
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector.
285 pages, 15 black & white tables, biography
| Mídia | Livros Paperback Book (Livro de capa flexível e brochura) |
| Lançado | 5 de setembro de 2014 |
| ISBN13 | 9781489983244 |
| Editoras | Springer-Verlag New York Inc. |
| Páginas | 285 |
| Dimensões | 155 × 235 × 16 mm · 426 g |
| Idioma | Inglês |
| Editor | Cahill, Sean S. |
| Editor | Kim, Franklin |
| Editor | Kuang, Ken |
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