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Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys - the Springer International Series in Engineering and Computer Science 2003 edition
Erdogan Madenci
Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys - the Springer International Series in Engineering and Computer Science 2003 edition
Erdogan Madenci
Discusses specific steps of the analysis method through examples without leaving any room for confusion. This title allows the engineers to conduct fatigue reliability analysis of solder joints in electronic packages.
205 pages, biography
Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
Lançado | 31 de dezembro de 2002 |
ISBN13 | 9781402073304 |
Editoras | Kluwer Academic Publishers |
Páginas | 205 |
Dimensões | 156 × 234 × 12 mm · 489 g |
Idioma | English |
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