Conte aos seus amigos sobre este item:
Materials for Advanced Semiconductor Packaging and Heterogeneous Integration
Materials for Advanced Semiconductor Packaging and Heterogeneous Integration
This book offers a comprehensive review of the key topics and the latest advancements in innovative materials for advanced semiconductor packaging and heterogeneous integration.
| Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
| A ser lançado | 20 de outubro de 2026 |
| ISBN13 | 9781032959436 |
| Editoras | Taylor & Francis Ltd |
| Páginas | 516 |
| Dimensões | 150 × 220 × 20 mm · 453 g |
| Editor | Shangguan, Dongkai |