Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019) - Asme - Livros - American Society of Mechanical Engineers - 9780791859322 - 30 de junho de 2020
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Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)

Asme

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Print proceedings of the InterPACK International Technical Conference on Packaging and Integration of Electronic and Photonic Microsystems Conference and Exhibition (IPACK2019)

A printed collection of 90 full-length, peer-reviewed technical papers. Topics include Autonomous, Hybrid, and Electric Vehicles; Energy Conversion and Storage; Flexible and Wearable Electronics; Heterogeneous Integration; Photonics and Optics; and Power Electronics.


836 pages

Mídia Livros     Paperback Book   (Livro de capa flexível e brochura)
Lançado 30 de junho de 2020
ISBN13 9780791859322
Editoras American Society of Mechanical Engineers
Páginas 836
Dimensões 279 × 215 × 48 mm   ·   1,88 kg

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