Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing - Liu, Shen (Huazhong University of Science and Technology, Wuhan, Hubei, China) - Livros - John Wiley & Sons Inc - 9780470827802 - 21 de outubro de 2011
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Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

Liu, Shen (Huazhong University of Science and Technology, Wuhan, Hubei, China)

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Modeling and Simulation for Microelectronic Packaging Assembly: Manufacturing, Reliability and Testing

An understanding of modeling and simulation techniques is becoming increasingly essential for engineers and researchers working with microelectronic packaging, interconnection design, and assembly manufacturing. This book shows for the first time how to model and simulate various processes in manufacturing, reliability, and testing.


576 pages, illustrations

Mídia Livros     Hardcover Book   (Livro com lombada e capa dura)
Lançado 21 de outubro de 2011
ISBN13 9780470827802
Editoras John Wiley & Sons Inc
Páginas 576
Dimensões 175 × 252 × 36 mm   ·   1,13 kg
Idioma English  

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