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Solder Joint Reliability: Theory and Applications 1991 edition
John H. Lau
Solder Joint Reliability: Theory and Applications 1991 edition
John H. Lau
New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them.
631 pages, 146 black & white illustrations, biography
Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
Lançado | 31 de maio de 1991 |
ISBN13 | 9780442002602 |
Editoras | Van Nostrand Reinhold Inc.,U.S. |
Páginas | 631 |
Dimensões | 155 × 235 × 34 mm · 975 g |
Idioma | English |
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