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Microelectronics Packaging Handbook: Subsystem Packaging Part III 2nd ed. 1997 edition
R.R. Tummala
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Microelectronics Packaging Handbook: Subsystem Packaging Part III 2nd ed. 1997 edition
R.R. Tummala
Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages.
657 pages, biography
| Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
| Lançado | 31 de janeiro de 1997 |
| ISBN13 | 9780412084515 |
| Editoras | Chapman and Hall |
| Páginas | 628 |
| Dimensões | 155 × 235 × 36 mm · 993 g |
| Idioma | English French |
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