
Conte aos seus amigos sobre este item:
Electromigration in Thin Films and Electronic Devices: Materials and Reliability - Woodhead Publishing Series in Electronic and Optical Materials
Choong-Un Kim
Electromigration in Thin Films and Electronic Devices: Materials and Reliability - Woodhead Publishing Series in Electronic and Optical Materials
Choong-Un Kim
352 pages
Mídia | Livros Paperback Book (Livro de capa flexível e brochura) |
Lançado | 11 de setembro de 2011 |
Data do lançamento original | 2016 |
ISBN13 | 9780081016961 |
Editoras | Elsevier Science & Technology |
Páginas | 352 |
Dimensões | 494 g |
Editor | Kim, Choong-Un (University of Texas at Arlington, USA) |
Ver tudo de Choong-Un Kim ( por exemplo Paperback Book )