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Testing of Interposer-Based 2.5D Integrated Circuits 1st ed. 2017 edition
Ran Wang
Testing of Interposer-Based 2.5D Integrated Circuits 1st ed. 2017 edition
Ran Wang
The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies.
182 pages, 50 Tables, color; 102 Illustrations, color; 16 Illustrations, black and white; XIV, 182 p
Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
Lançado | 29 de março de 2017 |
ISBN13 | 9783319547138 |
Editoras | Springer International Publishing AG |
Páginas | 182 |
Dimensões | 453 g |
Idioma | German |