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Advanced Materials and Design for Electromagnetic Interference Shielding Tong, Xingcun Colin, Ph.D. 1º edição
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Advanced Materials and Design for Electromagnetic Interference Shielding
Tong, Xingcun Colin, Ph.D.
Exploring the role of EMI shielding in EMC design, this book introduces the design guidelines, materials selection, characterization methodology, manufacturing technology, and future potential of EMI shielding. It covers an array of issues in advanced shielding materials and design solutions, including enclosures and composites.
344 pages, 114 black & white illustrations, 26 black & white tables
| Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
| Lançado | 19 de novembro de 2008 |
| ISBN13 | 9781420073584 |
| Editoras | Taylor & Francis Inc |
| Páginas | 340 |
| Dimensões | 161 × 242 × 23 mm · 636 g |
| Idioma | Inglês |
![Cover for Tong, Xingcun Colin, Ph.D. · Functional Metamaterials and Metadevices - Springer Series in Materials Science (Hardcover Book) [1st ed. 2018 edition] (2017)](https://imusic.b-cdn.net/images/item/original/431/9783319660431.jpg?tong-xingcun-colin-ph-d-2017-functional-metamaterials-and-metadevices-springer-series-in-materials-science-hardcover-book&class=scaled&v=1619643356)
![Cover for Tong, Xingcun Colin, Ph.D. · Advanced Materials for Thermal Management of Electronic Packaging - Springer Series in Advanced Microelectronics (Hardcover Book) [2011 edition] (2011)](https://imusic.b-cdn.net/images/item/original/588/9781441977588.jpg?tong-xingcun-colin-ph-d-2011-advanced-materials-for-thermal-management-of-electronic-packaging-springer-series-in-advanced-microelectronics-hardcover-book&class=scaled&v=1406142930)
