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Integrated Circuit Failure Analysis: A Guide to Preparation Techniques - Quality and Reliability Engineering Series
Beck, Friedrich (Siemens AG, Munich, Germany)
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Integrated Circuit Failure Analysis: A Guide to Preparation Techniques - Quality and Reliability Engineering Series
Beck, Friedrich (Siemens AG, Munich, Germany)
The construction and failure analysis of highly integrated semiconductor components has gained in significance with the explosive growth in the semiconductor industry. Once a subordinate laboratory task, semiconductor failure analysis has now become a discipline in its own right.
190 pages, index
| Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
| Lançado | 19 de janeiro de 1998 |
| ISBN13 | 9780471974017 |
| Editoras | John Wiley & Sons Inc |
| Páginas | 190 |
| Dimensões | 237 × 159 × 16 mm · 396 g |
| Idioma | English |
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