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Soldering Processes and Equipment
MG Pecht
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Soldering Processes and Equipment
MG Pecht
Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances.
312 pages, Ill.
| Mídia | Livros Hardcover Book (Livro com lombada e capa dura) |
| Lançado | 6 de julho de 1993 |
| ISBN13 | 9780471591672 |
| Editoras | John Wiley & Sons Inc |
| Páginas | 312 |
| Dimensões | 158 × 221 × 23 mm · 549 g |
| Idioma | English |
| Editor | Pecht, Michael (University of Maryland, College Park) |
